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赫比國際
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電子/芯片/半導體· 10000人以上

Hi-P established its industrial roots as an insert molding and metal forming tool maker founded in 1980. In 1983, current Executive Chairman and Chief Executive Officer, Yao Hsiao Tung acquired management of company. After the worldwide recessions of the mid 80's, Hi-P's success flourished with the expansion of overseas manufacturing facilities in 1993. Robust growth throughout the next 10 years, Hi-P is now known as one of the many defining moments, a listing on SGX, the Singapore stock exchange. Today, as a leading contract manufacturing provider, Hi-P maintains a clear focus in contributing to our clients' competitive advantage by developing and providing manufacturing solutions of exceptional value. An efficient, continuous work flow, utilizing the latest in technology and waste-free operations are the hallmark of the company. Coupled with its solid relationships with clients, these elements have provided the economic support to allow Hi-P to grow as a business that lives by its core values of integrity and finding the best possible solutions for our customers.
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工商信息
數據來源:

企業全稱

赫比(上海)電子有限公司

成立時間

1992年01月24日

注冊資本

4192萬人民幣

法人代表

姚曉東

注冊地址

上海市浦東新區祝橋空港工業區金聞路77號3幢1樓B區

統一信用代碼

913101156072007899

所屬行業

電子技術/半導體/集成電路

所在地

上海

登記機關

浦東新區市場監督管理局

營業期限

1992-01-24

企業類型

有限責任公司(外國法人獨資)

經營狀態

存續

經營范圍

生產銷售精密模具及其軟件和接插件,精密微型開關等電子零件,銷售自產產品。在上海浦東張江路1616弄3號、4號內從事自有房屋租賃服務。 【依法須經批準的項目,經相關部門批準后方可開展經營活動】

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